PCB (Printed Circuit Board) as an electronic deviceSkeleton and Central Nervous SystemAlmost permeates all fields of modern technology. The following is a deep analysis of its core application scenarios and technical characteristics:

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1、 In the field of consumer electronics

Technology TrendsFolding screen phone push3D dynamic bending FPC(Bending life>200000 times), the demand for Mini LED backlight driver boards has exploded.

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2、 Industry and Automation

Pain point breakthroughSchneider Electric adoptsEmbedded capacitor PCBReduce power noise by 40%.

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3、 Automotive Electronics

Data InsightNew energy vehicle PCB usage reachesTraditional cars 2.5 timesThe value of the bicycle ranges from $80 to $200, and the unit price of PCB for LiDAR exceeds $500.

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4、 Communication infrastructure

Material RevolutionCarbon hydrogen resin substrate replaces traditional FR-4, reducing dielectric loss (Df)0.001(Improve signal integrity).

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5、 Medical Electronics

safety standardsMedical PCB must pass throughISO 13485 certificationImplanted devices must meet biocompatibility requirementsISO 10993.

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6、 Aerospace and Military Industry

Domestic breakthroughDeveloped by China Electronics Technology Group Corporation's 14th InstituteAluminum nitride ceramic substrateThe thermal conductivity reaches180W/mK(Solve the heat dissipation of phased array radar).

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7、 Emerging fields

1. AI computing hardware

   • GPU/TPU acceleration card: 20 layer HDI board, 0.1mm micro hole

   • Cambrian Siyuan 290 chip carrier board: packaging substrate PCB heterogeneous integration

2. quantum computing

   • Superconducting quantum chip control board: microwave impedance consistency ± 1%

   • The 3D cavity PCB developed by Benyuan Quantum has a quality factor Q>1 million

3. brain-computer interface

   • Flexible neural electrode array: Platinum microelectrode on PI substrate (diameter 10 μ m)

   • Neuralink implantable PCB thickness is only 50 μ m

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Chinese manufacturing advantage scenario

• Consumer ElectronicsPearl River Delta manufacturers dominate 80% of global mobile phone PCB supply (Pengding Holdings/Shennan Circuit)

• New energy vehiclesShanghai Electric Power Co., Ltd. has entered Tesla's supply chain, with a market share of 35% in the automotive radar board market

• PV InverterSunshine power supply adopts domestic aluminum substrate, with a cost 40% lower than Europe and America

• 5G infrastructureShengyi Technology breaks Rogers' monopoly with high-frequency CCL, offering a 30% lower price

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The tipping point of future technology

• Embedded component PCBResistors/capacitors embedded in substrate (reducing surface mount components by 70%)

• 3D Printed ElectronicsNano Silver Conductive Ink Direct Writing Circuit (Nano Dimension, USA)

• Degradable PCBCellulose based zinc conductor (developed by Jiva Materials in the UK)

Design recommendations：

• High frequency scene optimizationRogers RO3003perhapsShengyi Technology SYT-5Gbase material

• Adopting high heat dissipation requirementsBeige aluminum substrateperhapsCopper graphene composite substrate

• Military grade products must comply withIPC-6012 Class 3standard

PCB technology is evolving fromConnection carrierdirectionFunction integration platformEvolution, China relies onMaterial Innovation Intelligent FactoryAccelerating the capture of high-end markets, especially in the three major tracks of new energy vehicles, 5G, and AI, such as the Industry 4.0 SMT production line, has formed global competitiveness.