E-mail:szbldpcb@163.com
Hotline number:0755-26652383
E-mail:szbldpcb@163.com
Hotline number:0755-26652383
| project | project name | Process capability |
|---|---|---|
| Overall process capability | Number of layers | Floors 1-30 |
| High frequency hybrid HDI | Ceramic materials and PTFE materials can only be drilled by mechanical drilling, blind burial, controlled depth drilling, back drilling, etc. (laser drilling is not allowed, and copper foil cannot be directly pressed) | |
| High speed HDI | Produced according to standard HDI procedures | |
| Laser order | Levels 1-5 (review required for levels ≥ 6) | |
| Plate thickness range | 0.1-5.0mm (less than 0.2mm, greater than 6.5mm to be reviewed) | |
| Minimum finished product size | Single board 5 * 5mm (less than 3mm requires review) | |
| Maximum finished product size | 2-20 floors 21 * 33 inches; Note: If the short edge of the board exceeds 21 inches, it needs to be reviewed. | |
| Maximum completed copper thickness | Outer layer 8OZ (review required for sizes greater than 8OZ), inner layer 6OZ (review required for sizes greater than 6OZ) | |
| Minimum completed copper thickness | 1/2oz | |
| Interlayer alignment | ≤3mil | |
| Range of through-hole filling | Plate thickness ≤ 0.6mm, aperture ≤ 0.2mm | |
| Thickness range of resin plug hole plate | 0.254-6.0mm, PTFE board resin plug hole needs to be reviewed | |
| Plate thickness tolerance | Plate thickness ≤ 1.0mm; ± 0.1mm | |
| Plate thickness>1.0mm; ± 10% | ||
| Impedance tolerance | ±5Ω（＜50Ω），±10%（≥50Ω）； ± 8% (≥ 50 Ω, subject to review) | |
| Warpage | Conventional: 0.75%, limit 0.5% (subject to review), maximum 2.0% | |
| Number of pressing cycles | Pressing the same core board ≤ 5 times (review required for more than 3 times) | |
| Material type | Ordinary Tg FR4 | Shengyi S1141, Jiantao KB6160A, Guoji GF212 |
| Medium Tg FR4 | Shengyi S1150G (medium Tg board), Jiantao KB6165F, Jiantao KB6165G (halogen-free) | |
| High Tg FR4 | Shengyi S1165 (halogen-free), Jiantao KB6167G (halogen-free), Jiantao KB6167F | |
| aluminum substrate | Guoji GL12, Clear CS-AL-88/89 AD2, Juqin JQ-143 1-8 layer mixed pressure FR-4 | |
| Types of materials used for HDI boards | LDPP (IT-180A 1037 and 1086), regular 106 and 1080 | |
| High CTI | Shengyi S1600 | |
| High Tg FR4 | Isola：FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR； Lianmao: IT-180A IT-150DA； Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI; Panasonic: R-5775K (Megtron 6), R-5725 (Megtron 4); Jiantao: KB6167F; Taiguang: EM-827; Hongren: GA-170; South Asia: NP-180; Taiyao: TU-752, TU-662; Hitachi: MCL-BE-67G (H), MCL-E-679 (W), MCL-E-679F (J); Tenghui: VT-47; |
|
| Ceramic powder filled high-frequency materials | Rogers：Rogers4350、Rogers4003; Arlon:25FR、25N; | |
| Polytetrafluoroethylene high-frequency material | Rogers series, Taconic series, Arlon series, Nelco series, TP series | |
| PTFE semi cured sheet | Taconic: TP series, TPN series, HT1.5 (1.5mil), Fastrise series | |
| Material mixing pressure | Rogers, Taconic, Arlon, Nelco, and FR-4 | |
| Metal substrate | Number of layers | Aluminum and copper substrates: 1-8 layers; Cold plate, sintered plate, buried metal plate: 2-24 layers; Ceramic board: 1-2 layers; |
| Finished product dimensions (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) | MAX:610*610mm、MIN:5*5mm | |
| Maximum production size (ceramic board) | 100*100mm | |
| Finished board thickness | 0.5-5.0mm | |
| copper thickness | 0.5-10 OZ | |
| Metal base thickness | 0.5-4.5mm | |
| Metal based material | AL：1100/1050/2124/5052/6061； Copper: Purple copper, pure iron | |
| Minimum finished aperture and tolerance | NPTH: 0.5 ± 0.05mm; PTH (aluminum substrate, copper substrate): 0.3 ± 0.1mm; PTH (cold plate, sintered plate, buried metal plate): 0.2 ± 0.10mm; | |
| Shape processing accuracy | ±0.2mm | |
| Surface treatment process for PCB parts | Lead free tin spraying; OSP； Sinking nickel (palladium) gold; Electric (nickel) soft/hard gold; Electroplated tin plating; Nickel free electroplating of soft and hard gold; Thick gold production | |
| metal surface treatment | Copper: Nickel plated gold; Aluminum: anodizing, hard oxidation, chemical passivation; Mechanical processing: dry sand spraying, wire drawing | |
| Metal based materials | Full treasure aluminum substrate (T-110, T-111); Tenghui aluminum substrate (VT-4A1, VT-4A2, VT-4A3); Laird aluminum substrate (1KA04, 1KA06); Beige metal substrate (MP06503, HT04503); TACONIC metal substrates (TLY-5, TLY-5F); | |
| Thickness of thermal conductive adhesive (dielectric layer) | 75-150um | |
| Size of buried copper block | 3*3mm—70*80mm | |
| Flatness of buried copper blocks (drop accuracy) | ±40um | |
| Distance from buried copper block to hole wall | ≥12mil | |
| thermal conductivity | 0.3-3W/m.k (aluminum substrate, copper substrate, cold plate); 8.33W/m.k (sintered plate); 0.35-30W/m.k (buried metal plate); 24-180W/m.k (ceramic board); | |
| product type | rigid plate | Backboard HDI、 Multi layer buried blind holes, thick copper plates, thick copper power supplies, semiconductor test boards |
| Stacking method | Multiple compression blind buried orifice plates | Same side compression ≤ 3 |
| HDI board type | 1 n 1, 1 1 n 1, 2 n 2, 3 n 3 (buried holes in n ≤ 0.3mm), laser blind holes can be electroplated and filled | |
| Local mixed pressure | Minimum distance from mechanical drilling to conductor in local mixed pressure area | ≤ 10 layers: 14mil; 12th floor: 15mil; 12th floor: 18mil |
| Minimum distance from local mixed pressure boundary to drilling hole | ≤ 12 layers: 12mil; 12th floor: 15mil | |
| Surface Treatment | unleaded | Electroplating copper nickel gold, immersion gold, hard gold plating (with/without nickel), gold-plated fingers, lead-free tin spraying OSP、 Chemical nickel palladium gold, soft gold plating (with/without nickel), silver deposition, tin deposition ENIG OSP、ENIG G/F、 Full board gold-plated G/F, silver plated G/F, tin plated G/F |
| There is lead | Lead spray tin | |
| Thickness to diameter ratio | 10: 1 (Lead/lead-free tin spraying, chemical nickel gold deposition, silver deposition, tin deposition, chemical nickel palladium gold); 8：1（OSP） | |
| Processing size (MAX) | Gold deposition: 520 * 800mm, vertical tin deposition: 500 * 600mm, horizontal tin deposition: less than 500mm on one side; horizontal silver deposition: less than 500mm on one side; lead/lead-free spray tin: 520 * 650mm; OSP: less than 500mm on one side; electroplated hard gold: 450 * 500mm; not allowed to exceed 520mm on one side | |
| Processing size (MIN) | Tin deposition: 60 * 80mm; Silver deposition: 60 * 80mm; Lead/lead-free spray tin: 150 * 230mm; OSP: 60 * 80mm; At the surface of the walking board that is smaller than the above size | |
| Processing plate thickness | Gold deposition: 0.2-7.0mm, tin deposition: 0.3-7.0mm (vertical tin deposition line), 0.3-3.0mm (horizontal line); Silver deposition: 0.3-3.0mm; lead/lead-free tin spraying: 0.6-3.5mm; tin spraying plates below 0.4mm require review and production; OSP：0.3-3.0mm； Electroplated hard gold: 0.3-5.0mm (plate thickness ratio 10:1) | |
| The minimum spacing between the IC of the gold-plated board or the minimum spacing between the PAD and the wire | 3mil | |
| Golden finger height maximum | 1.5inch | |
| Minimum distance between golden fingers | 6mil | |
| Minimum interval between segmented golden fingers | 7.5mil | |
| Surface coating thickness | HASL | 2-40um (the thinnest thickness of the lead sprayed tin surface is 0.4um, and the thinnest thickness of the lead-free sprayed tin surface is 1.5um) |
| OSP | Film thickness: 0.2-0.4um | |
| Chemical nickel gold deposition | Nickel thickness: 3-5um; Gold thickness: 1-3uinch, review required for ≥ 3uinch | |
| Chemical precipitation of silver | 6-12uinch | |
| Chemical tin deposition | Tin thickness ≥ 1um | |
| Electroplated hard gold | 2-50uinch | |
| Electroplating soft gold | Gold thickness 0.10-1.5um (dry film plating process), gold thickness 0.10-4.0um (non dry film plating process) | |
| Chemical nickel palladium gold | NI:3-5um，Pd：1-6uinch，Au：1-4uinch | |
| Electroplated copper nickel gold | Gold thickness 0.025-0.10um, nickel thickness ≥ 3um, maximum base copper thickness 1OZ | |
| Gold finger nickel plating | Gold thickness 1-50uinch (required value refers to the thinnest point), nickel thickness ≥ 3um | |
| Carbon Oil | 10-50μm | |
| green oil | Copper surface cover oil (10-18um), through-hole cover oil (5-8um), line corner ≥ 5um (one-time printing, copper thickness below 48um) | |
| Blue Glue | 0.20-0.80mm | |
| drill | 0.1/0.15/0.2mm maximum plate thickness for mechanical drilling | 0.8mm/1.5mm/2.5mm |
| Laser drilling with the smallest aperture | 0.1mm | |
| Laser drilling with maximum aperture | 0.15mm | |
| Mechanical hole diameter (finished product) | 0.10-6.2mm (corresponding to drill bit 0.15-6.3mm) | |
| The minimum finished hole diameter of PTFE material (mixed pressure) plate is 0.25mm (corresponding to a drill bit diameter of 0.35mm) | ||
| Mechanical blind hole diameter ≤ 0.3mm (corresponding to drilling tool 0.4mm) | ||
| Disk hole green oil plug hole drilling diameter ≤ 0.45mm (corresponding to drill bit 0.55mm) | ||
| The minimum diameter of the connecting hole is 0.35mm (corresponding to a drilling tool diameter of 0.45mm) | ||
| The minimum diameter of the metalized half hole is 0.30mm (corresponding to a drilling tool of 0.4mm) | ||
| Maximum thickness to diameter ratio of through-hole plate | 20: 1 (Excluding tool diameter ≤ 0.2mm; >12:1 to be evaluated) | |
| Laser drilling with maximum depth to aperture ratio | 1：1 | |
| Mechanical controlled deep drilling for blind holes with maximum depth to aperture ratio | 1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm) | |
| Mechanical controlled deep drilling (back drilling) with minimum depth | 0.2mm | |
| Drilling - Minimum distance from mechanical drilling to conductor (non buried blind hole plate and first-order laser blind hole) | 5.5mil (≤ 8 layers); 6.5mil（10-14）； 7mil (>14 layers) | |
| Drilling - Minimum distance from mechanical drilling to conductor (mechanical buried blind hole plate and second-order laser buried blind hole) | 7mil (one-time compression); 8mil (secondary compression); 9mil (three presses) | |
| Drilling - Minimum distance from mechanical drilling to conductor (laser blind buried hole) | 7mil（1 N 1）； 8mil (1 1 N 1 1 or 2 N 2) | |
| Drilling - laser drilling to the minimum distance of the conductor (1st and 2nd order HDI board) | 5mil | |
| Drilling - Minimum distance between different network hole walls (after compensation) | 10mil | |
| Drilling - Minimum distance between walls of holes in the same network (after compensation) | 6mil (through-hole; Laser blind hole); 10mil (mechanical blind buried hole) | |
| Minimum distance between borehole and non-metallic borehole wall (after compensation) | 8mil | |
| Drilling hole position tolerance (compared to CAD data) | ±2mil | |
| Drilling - NPTH hole diameter tolerance minimum | ±2mil | |
| Drilling - Precision of hole diameter for solder free devices | ±2mil | |
| Drilling - Cone hole depth tolerance | ±0.15mm | |
| Drilling - Cone shaped hole diameter tolerance | ±0.15mm | |
| Solder pad (ring) | The smallest size of the inner and outer solder pads in the laser hole | 10mil (4mil laser hole), 11mil (5mil laser hole) |
| Minimum size of inner and outer solder pads in mechanical via holes | 16mil (8mil aperture) | |
| BGA solder pad diameter minimum | Lead spray tin process 10mil, lead-free spray tin process 12mil, other processes 7mil | |
| Solder Pad Tolerance (BGA) | /-1.2mil (solder pad<12mil); /-10% (solder pad ≥ 12mil) | |
| Line width/spacing | Limit line width corresponding to copper thickness | |
| 1/2OZ：3/3mil | ||
| 1OZ: 3/4mil | ||
| 2OZ: 5/5mil | ||
| 3OZ: 7/7mil | ||
| 4OZ: 12/12mil | ||
| 5OZ: 16/16mil | ||
| 6OZ: 20/20mil | ||
| 7OZ: 24/24mil | ||
| 8OZ: 28/28mil | ||
| 9OZ: 30/30mil | ||
| 10OZ: 32/30mil | ||
| Line width tolerance | ≤10mil： /-1.0mil | |
| ＞10mil： /-1.5mil | ||
| Solder mask character | Maximum drilling diameter of solder mask plug hole (with oil cover on both sides) | 0.5mm |
| Solder mask ink color | Green, yellow, black, blue, red, white, purple, matte green, matte oil black, high refractive index white oil | |
| Character ink color | White, yellow, black | |
| Maximum diameter of blue adhesive aluminum plug hole | 5mm | |
| Resin plug hole drilling aperture range | 0.1-1.0mm | |
| Maximum thickness to diameter ratio of resin plug hole | 12：1 | |
| Minimum width of solder bridge | Special requirements are needed for controlling solder bridges with 4mil green oil and 6mil mixed color | |
| Minimum character line width | White characters 3mil high 24mil; Black characters 5ml high 32mil | |
| Minimum spacing for hollow characters | Hollow width 8mil, height 40mil | |
| Solder mask hollow letters | Hollow width 8mil, height 40mil | |
| shape | Distance from the centerline of V-CUT without copper leakage to the graphic | H ≤ 1.0mm: 0.3mm (20 ° refers to V-CUT angle), 0.33mm (30 °), 0.37mm (45 °); |
| 1.0 ＜ H ≤ 1.6mm: 0.36mm (20 °), 0.4mm (30 °), 0.5mm (45 °); | ||
| 1.6<H ≤ 2.4mm: 0.42mm (20 °), 0.51mm (30 °), 0.64mm (45 °); | ||
| 2.4<H ≤ 3.2mm: 0.47mm (20 °), 0.59mm (30 °), 0.77mm (45 °); | ||
| V-CUT symmetry tolerance | ±4mil | |
| The maximum number of V-CUT lines | 100 items | |
| V-CUT angle tolerance | ± 5 degrees | |
| V-CUT angle specification | 20. 30, 45 degrees | |
| Golden finger chamfer angle | 20. 30, 45 degrees | |
| Golden finger chamfer angle tolerance | ± 5 degrees | |
| The minimum distance for TAB near the golden finger to prevent tipping injuries | 6mm | |
| Minimum distance between the side edge of the golden finger and the outer edge line | 8mil | |
| Depth accuracy of controlled depth milling groove (edge) (NPTH) | ±0.10mm | |
| Boundary dimension accuracy (edge to edge) | ±8mil | |
| Minimum tolerance for milling slot holes (PTH) | Slot width and slot length direction are both ± 0.15mm | |
| Minimum tolerance for milling slot holes (NPTH) | Slot width and slot length direction are both ± 0.10mm | |
| Minimum tolerance of drilling slot (PTH) | Slot width direction ± 0.075mm; slot length/width<2: slot length direction/-0.1mm; slot length/width ≥ 2: slot length direction/-0.075mm | |
| Minimum tolerance for drilling slot holes (NPTH) | Slot width direction ± 0.05mm; slot length/width<2: slot length direction/-0.075mm; slot length/width ≥ 2: slot length direction/-0.05mm |
Address: 5th Floor, Science and Technology Building, Xinghua Road, Fuyong, Bao'an District, Shenzhen
Mr. Zhong (Marketing Director) 13590338876
Miss Liu (Head of Business Department) 13570886571
Phone: 0755-26652383 27873199
Email: szbldpcb@163.com
